Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 4 Quality Education -
SDG 6 Clean Water and Sanitation -
SDG 14 Life Below Water
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Dive into the research topics where Mavindra Ramadhani is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Liquid/Solid Interfacial Reactions Between Lead-Free Solders and Cu-6.01wt.% Sn-0.12wt.%P Alloy
Yen, Y. W., Ramadhani, M., Chen, C. M., Huang, Y. E., Hsiao, H. M. & Chiu, H. Y., Feb 2026, In: Journal of Electronic Materials. 55, 2, p. 1635-1647 13 p.Research output: Contribution to journal › Article › peer-review
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Effect of the pH with NaOH additives on the precipitation process of ferronickel leaching products from mini blast furnaces for NiSO4·6H2O synthesis
Ananda, M. B., Vidathya, I. G. N. D., Ramadhani, M., Abdul, F. & Pintowantoro, S., Mar 2024, In: Sadhana - Academy Proceedings in Engineering Sciences. 49, 1, 8.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
Interfacial Reactions in the Sn-3.0 wt.%Ag-0.5 wt.% Cu (SAC)/Cu-Ni-Si-Mg Alloy (C7025) Couples
Ramadhani, M., Laksono, A. D., Liou, Y. C. & Yen, Y. W., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 213-214 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples
Yen, Y. W., Laksono, A. D., Liou, Y. C., Ramadhani, M., Lee, Y. Y. & Huang, S. C., Feb 2024, In: Journal of the Taiwan Institute of Chemical Engineers. 155, 105278.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
Influence of quenchant variations solution treatment and holding time artificial aging on microstructure and hardness of Cu-Zn-Al alloys in shape memory alloy materials
Ramadhani, M., Rochiem, R., Wibisono, A. T., Damastuti, R. & Indrajati, M. N., 3 May 2023, International Conference on Mechanical Engineering and Emerging Technologies, ICOMEET 2021. Son, L., Putra, H., Mulyadi, I. H., Malta, J. & Gasni, D. (eds.). American Institute of Physics Inc., 020011. (AIP Conference Proceedings; vol. 2592).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review