TY - GEN
T1 - An investigation of force, surface roughness and chip in surface grinding of SKD 11 tool steel using minimum quantity lubrication-MQL technique
AU - Soepangkat, Bobby O.P.
AU - Agustin, H. C.Kis
AU - Subiyanto, H.
N1 - Publisher Copyright:
© 2017 Author(s).
PY - 2017/6/15
Y1 - 2017/6/15
N2 - This research aimed to analyze the viability of the minimum quantity of lubricant (MQL) technique towards normal force, tangential force, surface roughness and chip formation in surface grinding of SKD 11 tool steel. The three surface grinding parameters were varied including the type of cooling method (MQL and dry), table speed, and depth of cut. Based on statistical analysis, depth of cut is the most influential factor which affects the four responses in both dry and MQL grinding. MQL could reduce normal force and tangential force considerably, but produce higher surface roughness. In MQL grinding, the chips removal took place mostly by shearing and fracturing.
AB - This research aimed to analyze the viability of the minimum quantity of lubricant (MQL) technique towards normal force, tangential force, surface roughness and chip formation in surface grinding of SKD 11 tool steel. The three surface grinding parameters were varied including the type of cooling method (MQL and dry), table speed, and depth of cut. Based on statistical analysis, depth of cut is the most influential factor which affects the four responses in both dry and MQL grinding. MQL could reduce normal force and tangential force considerably, but produce higher surface roughness. In MQL grinding, the chips removal took place mostly by shearing and fracturing.
UR - http://www.scopus.com/inward/record.url?scp=85021438364&partnerID=8YFLogxK
U2 - 10.1063/1.4985459
DO - 10.1063/1.4985459
M3 - Conference contribution
AN - SCOPUS:85021438364
T3 - AIP Conference Proceedings
BT - Green Process, Material, and Energy
A2 - Prasetyo, Hari
A2 - Setiawan, Wisnu
A2 - Suryawan, Fajar
A2 - Nugroho, Munajat Tri
A2 - Widayatno, Tri
A2 - Hidayati, Nurul
A2 - Setiawan, Eko
PB - American Institute of Physics Inc.
T2 - 3rd International Conference on Engineering, Technology, and Industrial Application - Green Process, Material, and Energy: A Sustainable Solution for Climate Change, ICETIA 2016
Y2 - 7 December 2016 through 8 December 2016
ER -