Composite of [HA/PMMA] for 3D-printer material application

Alva Edy Tontowi, Djoko Kuswanto, Ray Indra Sihaloho, Harini Sosiati*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Citations (Scopus)

Abstract

Synthetic hydroxyapatite (HA) and polymethylmethacrylate (PMMA) are among biomaterials that individually has been used in bone defect restoration. Pure HA powder is bioactive and biocompatible material, but it was difficult to be shaped into certain geometry as needed in many cases of restoration. While, PMMA may cause necrosis at the bone-cement interface due to the heat released during polymerization. In shaping technology, a 3D Printer technology is capable to cope a complex geometry and shape, but it is recently only dedicated for the non-medical application. In this study, HA was composed with PMMA to form biocomposite that potentially applicable as a feeder material of the 3D Printer. PMMA powder was blended with various concentration of MMA liquid (40, 45, 50, 55 and 60% v/w) to form PMMA pasta. This pasta was then composed of HA (powder) in various ratios (10, 20 and 30% w/w) and cast into a specimen mold. Tests were performed to observe diametral tensile strength and solidification time relevant to the need of printing application. Results show that increasing MMA within PMMA could make longer solidification time and reduce its tensile strength. Although, HA within PMMA may reduce the composite tensile strength, but it could improve its solidification time and important to improve its bioactive and osteoconductivity and even to speed up solidification process that needed in faster printing.

Original languageEnglish
Title of host publicationAdvances of Science and Technology for Society
Subtitle of host publicationProceedings of the 1st International Conference on Science and Technology 2015, ICST 2015
EditorsMuslim Mahardika, Roto Roto, Ahmad Kusumaadmaja, Sholihun, Tri Rini Nuringtyas, Adhika Widyaparaga, Nur Hadi
PublisherAmerican Institute of Physics Inc.
ISBN (Electronic)9780735414136
DOIs
Publication statusPublished - 21 Jul 2016
Externally publishedYes
Event1st International Conference on Science and Technology 2015, ICST 2015 - Yogyakarta, Indonesia
Duration: 11 Nov 201513 Nov 2015

Publication series

NameAIP Conference Proceedings
Volume1755
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference1st International Conference on Science and Technology 2015, ICST 2015
Country/TerritoryIndonesia
CityYogyakarta
Period11/11/1513/11/15

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