Experimental study on thermosyphon for shipboard high-power electronics cooling system

Qiusheng Liu*, Katsuya Fukuda, Purwono F. Sutopo

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

The closed-loop thermosyphon (CLT) has advantages of simple structure and reliability for transporting heat in long distances with small decrease in temperature. It is considered a promising cooling device for power electronics onboard ships. In this research, CLT for cooling of power electronics onboard ship was developed, and the performance was experimentally examined using a CLT apparatus. The performance was investigated for steady-state heat transfer under a wide range of pressures and heat loads from 18.3 kPa to 35.3 kPa and from 88.9 W to 616.2 W, respectively. The fill charge rates were 27% and 45%. The circulation coolant temperature at the condenser was set to 15°C. The measured data for each rated heat input were registered by a data logger in every 5-s increment of sampling data for a 30-min period. During the steady-state operation, CLT could maintain the system pressure and produced the vapor bulk temperature at around saturation boiling regime. The temperature distributions of the system were measured from each probed thermocouple along the loop. It is understood that higher heat inputs around above 349 W could keep the bulk vapor in an almost constant temperature from evaporation process up to the inlet position of the condenser. The condenser of the direct hull cooling method could also maintain the condensation process with a temperature decrease of around 30°C from the inlet vapor temperature of the condenser. It was clarified that the CLT has good thermal performance in the higher heat loads with low thermal resistance and provides a steady circulation loop from each two-phase process of heating in the evaporator and cooling during condensation.

Original languageEnglish
Pages (from-to)1077-1083
Number of pages7
JournalHeat Transfer Engineering
Volume35
Issue number11-12
DOIs
Publication statusPublished - 24 Jul 2014

Fingerprint

Dive into the research topics of 'Experimental study on thermosyphon for shipboard high-power electronics cooling system'. Together they form a unique fingerprint.

Cite this