@inproceedings{7dffc14d091b4238ab05b4a1eb7e4440,
title = "Hydrophobic silica coating based on waterglass on copper by electrophoretic depositon",
abstract = "Hydrophobic silica coating on copper (Cu) has been successfully prepared by electrophoretic deposition (EPD) of silica sol prepared from waterglass. trimethyl chlorosilane (TMCS) was used as the modifying agent to produce hydrophobic coating by replacing the silanol groups on the silica surface with alkyl groups. The hydrophobicity was indicated by the contact angle of water droplet on the coating surface. It has been shown that TMCS concentration plays an important role in the preparation of hydrophobic coating. However, higher concentration of TMCS made the copper corroded before coated with silica due to the production of Cl- ions when TMCS reacted with water and silanol groups during electrophoretic deposition. In addition, the electric field intensity, silica concentration and deposition time also influence the hydrophobicity of the coating. Increasing the three parameters produces silica coating with higher hydrophobicity. The contact angle of the silica coating can reach 130°. EIS analysis showed that the silica coating is very porous.",
keywords = "Electrophoretic deposition, Hydrophobic, Silica sol",
author = "E. Setyowati and Amalia, {S. F.} and Nazriati and Samsudin Affandi and Minta Yuwana and H. Setyawan",
year = "2014",
doi = "10.4028/www.scientific.net/AMM.493.749",
language = "English",
isbn = "9783037859902",
series = "Applied Mechanics and Materials",
pages = "749--754",
booktitle = "Advances in Applied Mechanics and Materials",
note = "International Conference on Mechanical Engineering, ICOME 2013 ; Conference date: 19-09-2013 Through 21-09-2013",
}