@inproceedings{10a4ee26e3dc4b03bd86c82acc34103b,
title = "Optimization Model of Multi Refrigerated-Container Loading Problem for Shipment Using Ventilated Cargo",
abstract = "Fruits and vegetables are a perishable product whose quality will decrease if stored for a long time in an unsupportive place. Refrigerated containers or reefer will keep the product at low temperature in shipping process. Cargo should be placed in an area within the reefer where the temperature is close to the optimal temperature for each product. This research will develop a Refrigerated-Container Loading Problem (R-CLP) model for refrigerated containers that load ventilated cargo for shipping fruits and vegetables. The model will be developed using constructive heuristic method using wall-building approach. Researchers will conduct simulations using Computational Fluid Dynamics (CFD) to obtain temperature distribution data in the reefer and the cargo. The purpose of this research is to produce a decision support tools to optimize the yield of agricultural and reduce food loss due to the distribution process. The numerical experiments result show about the ability of the model to minimize cost and quality loss. The numerical experiments result also show that using ventilated cargo have a better result than closed cargo for loading fruit products. The fruit produces heat as a result of respiration which must be removed from the cargo. Ventilation holes facilitate cool air from reefer entering the cargo and hot air from fruit exiting the cargo.",
keywords = "computational fluid dynamics, fruit, multi refrigretaed container loading problem, vegetable, ventilated cargos",
author = "Fadila Isnaini and Ahmad Rusdiansyah and Dewi, \{Ratna Sari\} and Adetio, \{Irza Rachmadiar\}",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 3rd IEEE Technology and Engineering Management Conference - Asia Pacific, TEMSCON-ASPAC 2024 ; Conference date: 25-09-2024 Through 27-09-2024",
year = "2024",
doi = "10.1109/TEMSCON-ASPAC62480.2024.11024933",
language = "English",
series = "TEMSCON-ASPAC 2024 - IEEE Technology and Engineering Management Conference - Asia Pacific",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "TEMSCON-ASPAC 2024 - IEEE Technology and Engineering Management Conference - Asia Pacific",
address = "United States",
}