Research progress, potentials, and challenges of copper composite for metal injection moulding feedstock

Widyastuti*, Eka Nurul Falah, Vania Mitha Pratiwi, Iyando Adityawan, Ninik Safrida, Elisabeth Wikandari, Alvin Rahmad Widiyanto, Romario Abdullah

*Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review


Copper has been widely used as a matrix for fabricating MMCs. In the last 10 years, reinforcement materials such as metal and carbon-based materials (CNT, graphene, diamond) have produced superior thermal and mechanical properties compared to pure Cu. MIM is a manufacturing technology for assembling components with complex geometric shapes. Based on the high level of MIM complexity, this method is ideally applied as an electronic component manufacturing method. Copper composite can be modified as feedstock for the MIM process to produce MIM products with high thermal conductivity and good electrical properties. However, there are several challenges in the fabrication process of modifying copper feedstock, such as differences in thermal properties between metal reinforcement (W and Mo) and the formation of agglomeration in carbon-based copper composites. This article review will discuss the potentials and challenges of each modifying feedstock and the parameters of the MIM-Cu process and fabrication technology for each MIM-Cu feedstock being developed.

Original languageEnglish
Article number119785
JournalPowder Technology
Publication statusPublished - 1 May 2024


  • Copper composite
  • Metal injection moulding
  • Thermal conductivity


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