Study numerical and experimental of stress concentration factor on isotropic plate with hole

M. N. Misbah*, R. C. Ariesta, T. Yulianto, D. Setyawan, W. H.A. Putra

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


The stress concentration factor (SCF) can lead to the failure of ship construction. That problem can occur with hotspot stress expansion in the local area because of the acting load and structural details shapes. However, there is no method for the asses of structure design failure in the minor openings such as a dry hole and scallop dimension. Furthermore, the research aims for evaluating stress concentration performed using the diameter and width (d/W) ratio. The model of plates generates to identify stress phenomena on the isotropic ship plate. The numerical simulation was carried out using finite element analysis and proven by experimental method with the installation of the strain measurement on several working loads of 30% and 60% under yield strength. The plate used for analysis is an A36 steel plate commonly used in the shipbuilding industry. The plate model with the hole was identified, which shows the stress concentration that occurs increases after the d/W of the isotropic plate also increases, then the comparative stress plot. Moreover, based on the numerical and experimental analysis, the comparisons of stress concentration factors within different radius holes have been completed for assessment. Finally, result from numerical and experimental obtained error values below 3%.

Original languageEnglish
Pages (from-to)397-406
Number of pages10
JournalMaterials Physics and Mechanics
Issue number3
Publication statusPublished - 2022


  • experimental
  • numerical
  • ship
  • stress concentration factor


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