TY - GEN
T1 - The Good News Impact on Stock Index Return (LQ-45 Indonesian Index)
AU - Kusumo, Dipa Ontowiryo
AU - Hakim, Muhammad Saiful
AU - Prihananto, Prahardika
AU - Cempaka, Santy Dwi
AU - Ninglasari, Sri Yayu
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Within the ongoing geopolitical tensions and economic uncertainties, the impact of news sentiment on stock returns remains a critical area of investigation. This study examines the association between news sentiment and stock returns in the Indonesian market, specifically focused on companies included in the LQ-45 stock index. We utilize TextBlob for sentiment analysis on news articles collected between August 2022 and January 2023. The results indicate that there are no statistically significant relationships between news sentiment and stock returns. In addition, the results also failed to find evidence of the associations for specific sectors in the index.
AB - Within the ongoing geopolitical tensions and economic uncertainties, the impact of news sentiment on stock returns remains a critical area of investigation. This study examines the association between news sentiment and stock returns in the Indonesian market, specifically focused on companies included in the LQ-45 stock index. We utilize TextBlob for sentiment analysis on news articles collected between August 2022 and January 2023. The results indicate that there are no statistically significant relationships between news sentiment and stock returns. In addition, the results also failed to find evidence of the associations for specific sectors in the index.
KW - LQ-45
KW - Sentiment Analysis
KW - TextBlob
UR - https://www.scopus.com/pages/publications/105009126373
U2 - 10.1109/TEMSCON-ASPAC62480.2024.11024969
DO - 10.1109/TEMSCON-ASPAC62480.2024.11024969
M3 - Conference contribution
AN - SCOPUS:105009126373
T3 - TEMSCON-ASPAC 2024 - IEEE Technology and Engineering Management Conference - Asia Pacific
BT - TEMSCON-ASPAC 2024 - IEEE Technology and Engineering Management Conference - Asia Pacific
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd IEEE Technology and Engineering Management Conference - Asia Pacific, TEMSCON-ASPAC 2024
Y2 - 25 September 2024 through 27 September 2024
ER -