This paper proposes a novel design of power divider based on SIW with extra via. Simulation and measurement are done to investigate the characteristic of the power divider. Characteristic dependence to the power divider structure parameters are investigated, such as: diameter of via, thickness of substrate, and feeding transition. The power divider is designed by using substrate with high constant dielectric (∈r = 6.15). The design obtain minimum structure of 64 × 95 mm which is reduced the size up to 80% comparing with the previous design. The measurement result is satisfied to requirement parameters target of return loss (S11) less than -14.3 dB, insertion loss (S21 and S31) more than - 4.3 dB with at frequency range of 2-3.5 GHz of fractional band width at 54.5%.

Original languageEnglish
Pages (from-to)195-201
Number of pages7
JournalARPN Journal of Engineering and Applied Sciences
Issue number1
Publication statusPublished - 1 Jan 2018


  • Microstrip
  • Power divider
  • SIW
  • Ultra-wide band


Dive into the research topics of 'Ultrawide band power divider based on substrate integrated waveguide (SIW) for S-band applications'. Together they form a unique fingerprint.

Cite this